We offer AMICON capillary flow and No Flow-Fluxing flip chip underfill encapsulants. Our capillary flow products are highly flowable, high purity, one-component encapsulants. They form a uniform and void-free underfill layer that protects the active surface of the die while improving the reliability performance of flip chip devices by distributing stress away from the solder interconnects.

We have formulations to quickly fill very small gap/pitch parts, cure quickly, have long pot and shelf life, and exhibit superior anti-settling characteristics. We also offer underfills that are snap curable and encapsulants designed for moisture-sensitive applications. Our underfills provide outstanding underfill-to-die passivation adhesion for maximum part performance and reliability.

No Flow-Fluxing Underfills

Also for flip chip, our innovative AMICON No Flow-Fluxing underfills make possible a simplified and less costly flip chip assembly process by eliminating tedious and expensive fluxing, flux cleaning, underfill capillary flow and post-cure operations. Effective with eutietic and high-temperature-melting solder balls, the result is a highly SMT-compatible flip chip manufacturing process versus traditional flip chip assembly that minimizes process steps and overall cost.

We offers several series of products which can be used in a No Flow-Fluxing underfill process. Once type does not cure during a standard reflow cycle, allowing flip chip parts to be reworked in-line. Following electrical testing, these flip chips can be quickly, easily and cost effectively removed to make the substrate same as original. A second type cures within a modified reflow cycle immediately after the solder joints are formed, eliminating post cure entirely.

Our popular and effective encapsulant lines for chip-on-board assembly provide the viscosity and rheological profiles needed for all chip-on-board assembly applications. Longer pot life stability, minimal variation from batch to batch and low CT are the hallmarks of the AMICON product line. In addition, these products meet your standards for ionic cleanliness and thermal performance, and can be tailored to your individual processing needs for glob top and dam-and-fill encapsulants.

Chip-On-Board Die Attach Adhesives

We've taken the best adhesives for demanding semiconductor packaging operations and adapted them for chip-on-board assembly applications. Our technology offers pre-mixed and frozen conductive adhesives and nonconductive adhesives for bonding integrated circuits directly onto the board. Known for their adhesion and resistance to thermal and physical stresses, our die attach adhesives boast favorable dispense properties and customized rheological characteristics.

Thermal Management Materials

Thermal overload caused nearly 75 percent of all electronic equipment failure. With that in mind, and to help you meet today's high power-circuit assembly demands, we've developed materials that not only bond components but also help you manage the heat on the circuit board. We offers thermally conductive paste-adhesives, thermal greases, wafers and plenty of real-world expertise in thermal management materials.

THERMAXX adhesives are ideal for a wide variety of applications, including:

• Discrete component assembly
• Heat sink and heat slug attach
• An easily applied alternative to eutectic thermal management product

THERMAXX thermal management adhesives can lower your process costs by eliminating expensive gold metal die attach processes. They can be used in standard dispensing equipment and curing ovens. They also eliminate the need for a nitrogen processing environment. THERMAXX materials have been shown to be wire bondable up to 250 degree Celsius. They exhibit low extractable ionics, low moisture uptake and excellent delamination properties. Lower modulus lowers stress on the die. This innovative adhesive line also offers you good dispensability and a 24-hour work life on the assembly line.

The promise of easy-to-use polymeric alternatives for solder is here in our advanced adhesives pastes. These fast-curing adhesives are designed to replace solder, meeting the electrical, thermal and mechanical requirements of solder without the negatives associated with lead. Our products fit easily into most surface mount assembly processes. These stress-absorbing adhesives are compatible with typical hybrid and PCB metallizations, and they provide improved line and thickness resolution. They may be applied by stencil, screen printing or syringe dispensing.

Typical applications:

• Applications demanding electrical conductivity and lower cure temperatures
• Non-rigid substrates, both for circuitry formation and component attach
• Surface mount component attach and interconnect applications on rigid substrates
• Applications that required high thermal conductivity
• Hybrid applications where silver migration is critical
• Hybrid component attach

A broad selection of electrically insulative adhesives is also available to you for: substrate attach and package sealing; heat sink attach; applications requiring lower-that-normal cure temperatures; ceramic or laminate substrates.

Film Adhesives

For large component assembly, our adhesive films allow components and parts to be bonded where pastes may not be optimal. We provide electrically and thermally conductive as well as nonconductive films, which are pre-formed and cut to your specifications.

The use of film adhesives reduces manufacturing costs and eliminates the need for expensive capital equipment for adhesive paste dispensing. While these products are perfect for low-volume assembly operations, we can provide the films on reels for automated, high-volume lines.

Typical of these highly advanced products is your silver-filled, flexible adhesive film, which is design for substrates with severely mismatched CTE and applications requiring conductive XYZ axes. Our moisture-resistant adhesive film provides good thermal conductivity and a thin, uniform bondline. It is ideal for bonding "hot" devices onto heat sinks.

for package lid sealing applications where performs cannot be used, our paste adhesives offer an excellent alternative, These high-strength, moisture-resistant, B-stageable epoxy adhesive pastes may be cured at temperatures as low as 150 degree Celsius.

Surface Mount Adhesives

We bring you a broad range of adhesives for circuits assembly. Our adhesives are designed for: high-speed syringe dispensing, stencil printing or pin transfer applications. The company's AMICON line includes syringe-dispense adhesives for very high speed (40,000 DPH), high speed (20,000 to 40,000DPH) and slow to moderate (20,000 DPH) dispensing. All exhibit excellent green strength to prevent component movement.

Conformal Coatings

Our ECCOCOAT conformal coatings are one-component, urethane, silicone or acrylate coatings which provide environmental protection for assembled circuits and electronic components.

These products have been tested to the stringent requirements of Mil Spec and UL.

Two key products in our conformal coatings line are urethane systems that proved you with a fast cure and excellent protection against harsh chemicals. They are designed to meet the most stringent environmental conditions. Both systems are compatible with industry standard solder masks no-clean fluxes, metallization, components and substrate materials.

Other high-performance ECCOCOAT systems include a heat-and-moisture-curing silicone that cures qucliky and bonds well to itself for reliable repair operations. In addition, we offer you a heat curing silicone featuring excellent adhesion to a variety of substrates and a rapid over cure. These products are formulated for dip or spray application. In addition, we offer a variety of high-reliability, chemically resistant acrylate coatings that can be removed for circuit repair.