3-D Laser Inspection
Solutions
For Solder
Paste
And
Component
Placement
Process
Improvement

Detecting Defects Early is the Key
to Reducing Rework, Scrap, and Field Failure
Costs
In a world of
relentlessly shorter product life cycles,
increased global competition, and heightened
consumers' expectations, SMT manufacturers have
increasingly recognized that reducing product
defects is a critical aspect of profitability and
a necessity for remaining competitive.
SMT
inspection provides these benefits:
Early Defect Detection.
Paste defects are
detected as they occur, allowing you to remove
defective boards before you add value. In
addition, component placement inspection provides
a means of detecting errors prior to reflow,
reducing expensive final rework.
Process Control.
The accurate
data collected is available for real-time
statistical process control.
Process Improvement.
Using
inspection data to better understand and control
your process enables faster start-up, faster
changeover, and continual process improvement.
Solder Paste Volume: The Key to
Solder Joint Quality
Studies have
shown that correct solder paste volume is the
most important variable in producing solder joint
quality. Joints produced with low paste volume
may visually appear adequate and may pass
functional test, but can result in field failure.
80% of all SMT board defects can be traced to the
paste application process.
SMT
inspection systems provide 3-D volumetric
measurements of all solder paste depositions.
Identifying out of range conditions for immediate
action and maximizing your manufacturing
efficiency.
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